Product Introduction:
Product Series: SPR 955-CM Series, Positive Photoresist, UV Photoresist.
Recommended Light Source: i-Line.
Single-Layer Thickness: 0.7–3.5 μm.
Models:
SPR 955-0.7 / SPR 955-0.9 / SPR 955-1.1 / SPR 955-1.4 / SPR 955-1.8 / SPR 955-2.1
Applications:
MEGAPOSIT SPR 955-CM Series photoresists are general-purpose, high-resolution i-Line photoresists, suitable for 0.35 μm front-end and back-end applications. They are also compatible with LOR/PMGI-SF bottom anti-reflective coatings for lift-off processes.
Features:
· High resolution with undercut profile.
· Achieves high-density lines and spaces, or isolated lines on polysilicon.
· Enables high-density, high-aspect-ratio lines and spaces on titanium nitride.
· Realizes dense hole patterning on silicon oxide.
· High-aspect-ratio hole formation.
· High photosensitivity.
