Silicon wafers are circular thin slices fabricated from ultra-high purity semiconductor-grade monocrystalline silicon through a series of precision processing procedures. The vast majority of semiconductor chips are manufactured on these silicon wafers via complex processes, thus imposing extremely stringent requirements on their electrical performance and cleanliness.
Classified by grade: prime wafers, test wafers and dummy wafers;
Classified by production method: CZ (Czochralski) silicon wafers and FZ (Floating Zone) silicon wafers;
Classified by origin: imported silicon wafers and domestic silicon wafers.
Diameter: 1 to 12 inches;
Thickness: 100μm to 1mm (customization available for larger and thicker dimensions;Crystal orientation: <100>, <110>, <111> and other orientations);
Surface treatment: single-side polished, double-side polished, lapped wafers;
Conductivity type: N-type, P-type, intrinsic;
Resistivity: 0.001 Ω·cm and above;
Shape & notch: standard flat orientation, circular wafers;
Geometric parameters: TTV (Total Thickness Variation), WARP, BOW and other key indicators.
Semiconductor field, solar cell field, photovoltaic (PV) industry, MEMS (Micro-Electro-Mechanical Systems), detectors, microwave devices, communications, computer and other electronic equipment fields, etc.
Silicon wafers serve as the core fundamental material for manufacturing all silicon-based semiconductor chips. Our company maintains a ready inventory of more than one thousand varieties of silicon wafers with various dimensions and specifications, with a stock volume of nearly 100,000 pieces. We can provide customized selection recommendations according to different application requirements, and offer custom fabrication services for special specifications, with flexible procurement methods available.
