Glass wafers are categorized into multiple grades based on their chemical compositions, such as borosilicate, aluminosilicate, quartz glass, etc. The commonly used grades include BF33, B270, D263T, HK9L and EAGLE XG.
Mainly classified by grades into BF33 glass wafers, B270 glass wafers, D263T glass wafers, HK9L glass wafers and other grades.
Diameter: 2 ~ 12 inches;
Surface treatment: double-side polished;
Grade: various grades available
Thickness: 100μm ~ 1mm (customization available for thicker dimensions).
Glass wafers are mainly used in manufacturing semiconductor packaging interposers, micro-electro-mechanical systems (MEMS) and display panels that require high flatness, optical transparency and process compatibility. They are also widely applied in advanced packaging, sensors, consumer electronics and other fields.
Glass wafers feature high flatness and dimensional stability, optical transparency, chemical stability, and adjustable thermal expansion coefficient. High-quality vias can be fabricated on them via laser or etching processes, which are suitable for vertical interconnection.
