Product Introduction:
Product Series: RE500 Series, Negative Electron Beam Resist.
Recommended Light Source: E-beam.
Single-Layer Thickness: 105 nm, 590 nm, 1 μm.
Models:
RE500.06 / RE500.20
Applications:
RE500 is a negative electron beam resist based on hydrogen silsesquioxane (HSQ) cage oligomer, suitable for use as a mask in nanoscale dry etching processes.
Features:
· High resolution (<20 nm) with low LWR.
· Excellent etch resistance (based on siloxane resin).
· Aqueous developer compatible.
· Performance comparable to imported products XR1541 and the FOX series.
