Product Introduction:
Product Series: SPR220 Series, Positive Photoresist, UV Photoresist.
Recommended Light Source: i-Line, also compatible with broadband exposure.
Single-Layer Thickness: 1–10 μm.
Models:
SPR220-3.0 / SPR220-4.5 / SPR220-7.0
Applications:
No photoresist cracking occurs during selective electroplating (gold, copper, nickel/iron plating); also suitable for processes such as deep silicon etching (DSE).
Features:
· Uniform single-layer coating thickness (＞10 μm).
· Excellent adhesion to metallic substrates.
· Resistant to dry/wet etching.
· Compatible with both metal-ion-free (MIF) and metal-ion-containing (MIC) developers.
