Product Introduction:
Product Series: SU-8 3000 Series, Negative Photoresist, Near UV (350–400 nm).
Recommended Light Source: i-Line, also applicable for E-beam and X-ray exposure.
Single-Layer Thickness: 5–100 μmCompared with the SU-8 2000 Series, the SU-8 3000 Series features improved substrate adhesion and reduced internal stress accumulation during processing.
Models:
SU-8 3005 / SU-8 3010 / SU-8 3025 / SU-8 3035 / SU-8 3050
Applications:
Optoelectronic devices, microfluidics, MEMS chip fabrication, as well as being used as chip insulation and protective layers.
Features:
· Low molecular weight.
· Excellent solubility.
· High transparency.
· Capable of forming smooth film layers.
· Low glass transition temperature (Tg).
· Reducible viscosity.
· Ultra-thick film formation via single spin coating (650 μm).
· Uniform coating thickness.
· High aspect ratio (10:1).
· Outstanding chemical resistance.
· Good biocompatibility (for microfluidic chips).
