Process Introduction:
Coating technologies including Electron Beam Evaporation, Magnetron Sputtering, LPCVD, PECVD, ALD (Atomic Layer Deposition), etc.
Magnetron Sputtering: Ti, Al, Ni, Au, Ag, Cr, Pr, Cu, Zn, Mo, W, Ta, etc.;
Electron Beam Evaporation: Ti, Al, Ni, Au, Cu, AuGe, Cr, Pt, In, Sn, etc.;
PECVD/LPCVD: SiO₂, SiNₓ, a-Si, etc.;
ALD (Atomic Layer Deposition): Silicon Oxide, Aluminum Oxide, etc.
