Model:
Remover PG
Main Component:
N-Methyl-2-pyrrolidone
CAS 872-50-4
Principle & Application Method:
Remover PG is a proprietary NMP-based solvent stripper. This solvent can completely remove PMMA, LOR, SU8, PMGI and other photoresists on Si, SiO₂, GaAs and other substrates or wafers via swelling/dissolution, and it can also be used as a lift-off solvent. Remover PG is applicable at room temperature, enabling slag-free removal of nearly all photoresist films (including PMGI & LOR, PMMA & copolymer, SU-8, g-Line, i-Line and DUV resists), and is compatible with automatic stripping equipment.
Application Method:
For immersion mode, a two-bath system is recommended to minimize the possibility of redeposition of stripped photoresist. The first bath removes the majority of the photoresist, while the second bath eliminates residual traces. The stripping solution in the bath should be replaced when the stripping rate decreases significantly (which can be determined by the number of processed wafers). A third bath with a water-miscible solvent (e.g., isopropanol, IPA) is used for final solvent rinsing prior to deionized (DI) water rinsing and drying. To enhance stripping performance, Remover PG can be used at an operating temperature above ambient temperature, with a maximum limit of 80℃. Caution for safe use: the flash point of Remover PG is 88ºC! Mechanical or ultrasonic agitation will improve the physical removal efficiency of swollen/dissolved photoresist from the substrate.
Ensure adequate ventilation and exhaust systems in the working area;
Store in sealed containers and keep in a cool, dry place;
Use explosion-proof equipment/devices and spark-proof tools;
Keep away from heat sources and direct sunlight;
Keep away from open flames and no smoking;
Prevent electrostatic discharge (ESD).
