Model:
Resist Developer RD6
Main Components:
Water ＞90%
CAS 7732-18-5
Tetramethylammonium Hydroxide (TMAH) ＜3%
CAS 75-59-2
Principle and Operating Instructions:
Resist Developer RD6 is an aqueous, metal-ion-free photoresist developer, suitable for NR1, NR5, NR7, NR9 series negative photoresists and PR1 series positive photoresists. It also serves as a remover for the temporary adhesion, protection and planarization materials of the PC4 series. Leveraging the chemical property differences between the exposed and unexposed areas of photoresists, Resist Developer RD6 selectively retains either the exposed or unexposed areas to obtain the desired photoresist structures, and acts as the basic solvent for the development of acidic photoresists. A small amount of surfactant is added to Resist Developer RD6 to reduce the occurrence of line undercutting.
Operating Instructions:
Pour the developer into the photoresist developing tank;
Verify that the developer temperature is set to the specified value;
Develop the photoresist by immersion or spraying in accordance with the instructions in the Processing section of the applicable photoresist technical datasheet;
Rinse the substrate with deionized water until the water resistivity meets the specified standard.
Storage:
Ensure the working area is equipped with adequate ventilation and exhaust systems;
Store in a well-ventilated area;
Avoid direct sunlight exposure;
Seal in airtight storage containers;
Nitrogen blanket storage is recommended.
